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Silicon Nitride Material Properties Data

Reaction Bonded Silicon Nitride (RBSN)
 
Thermal reaction of silicon metal compacts and nitrogen produces Reaction Bonded Silicon Nitride. Complex components can be readily and economically produced by machining the material in the green state. RBSN is a moderately dense form of Silicon Nitride that does not contain a glassy second phase and therefore maintains its mechanical properties to 1400°C. Molten metal (non-ferrous) processing applications are ideal for RBSN because of excellent corrosion resistance and price performance relationships.
 
Reaction Bonded Silicon Nitride (RBSN) - Properties (Typical)*
 
   
Type
Bulk Desity 2.4-2.6 g/cm
Porosity (volume percent) 25-18
Flexural Strength (MOR) 
@ RT, 4 point average
289-338 MPa
42-49 ksi
Elastic Modulus (E)
160-179 GPa
23-26 Mpsi
Poisson's Ratio (v) 0.23-0.24
Fracture Toughness (whiskers) 3.0-3.6
Thermal Shock Resistance (T) 400-500°C
*Properties vary dependent upon green forming technique
 
"PAD" Silicon Nitride-SC
 

"PAD" Silicon Nitride-SC is a zero porosity, specially formulated silicon nitride material for use in the semiconductor industry. The mater­ial is 98% SiN with 2% densification addi­tives. The additives are nonalkaline metals.

 
"PAD" Silicon Nitride-SC - Properties (Typical)
 
   
Bulk Desity 3.15 g/cm
Flexural Strength (MOR) 
@ RT, 4 point average
100 ksi
Elastic Modulus (E)
46 Mpsi
Hardness (Knoop 1 kg) 1480 kg/mm
Thermal Expansion (RT-1000°C) 3.4 10/°C
Thermal Conductivity (RT) 30.0 W/m*K
 
"PAD" Silicon Nitride SC-1
 
The SC (semiconductor) grade is a fully dense, highly pure form of silicon nitride. Sinteririg aid content is minimized to main­tain purity and is selected for compatibility with the extreme environments associated with Si wafer processing. Sizes up to 500mm square or 730mm round are possible with PAD (Pressure Assisted Densification) processmg and the resultant products exhibit uniformly excellent mechanical properties.
 
"PAD" Silicon Nitride SC-1 - Properties (Typical)
 
   
Bulk Desity 3.18 g/cm
Average Grain Size .50 µm
Flexural Strength (MOR) 
@ RT, 4 point average
640 MPa
93 ksi
Characteristic Strength
 @ RT, 4 point
675 MPa
98 ksi
Weibull Modulus (m) 9
Elastic Modulus (E)
310 GPa
45 Mpsi
Poisson's Ratio (v) 0.27
Hardness (Knoop 1 kg) 1560 kg/mm
Fracture Toughness (Vickers) 5.7 MPa*m
Thermal Expansion (RT-1000°C) 3 3 10/°C
Thermal Conductivity (RT) 30.0 W/m*K
 
PSG Silicon Nitride
 

PSG Silicon Nitride is a fully dense, pressureless sintered ceramic specifically compounded to yield an amorphous intergranular phase. Pressureless sintering allows for net shape forming of complex components in a cost effective manner. This grade is isotropic with respect to engineering properties and offers excellent resistance to mechanical fatigue. PSO Si3N4 is useful for both large shaped, large cross-sectional structures as well as small, intricate components.

 
PSG Silicon Nitride - Properties (Typical)
 
   
Bulk Density 3.25 g/cm
Flexural Strength (MOR) 
@ RT, 4 point average
689 MPa
100 ksi
Characteristic Strength
 @ RT, 4 point
730 MPa
106 ksi
Weibull Modulus (m) 15
Elastic Modulus (E) 303 GPa
44 Mpsi
Poisson's Ratio (v) 0.24
Hardness (Knoop 1 kg) 1450 kg/mm
Fracture Toughness (Vickers) 5.7 MPa*m
Thermal Expansion (RT-1000°C) 3.3 10
Thermal Conductivity (RT) 29.5 W/m*k
Thermal Shock Resistance (T) 675°C
 
PSX Silicon Nitride
 
PSX is a fully dense, isotropic grade of Silicon Nitride offering excellent wear resistance and improved elevated temperature properties. Pressureless sintering allows for net shape forming of complex components for a wide variety of structural applications. Through exact control of processing and chemistry, the grain boundary or intergranular phase is engineered to be crystalline in PSX Si3N4. Heat engine components are an excellent application for this material.
 
PSX Silicon Nitride - Properties (Typical)
   
Bulk Density 3.27 g/cm
Flexural Strength (MOR) 
@ RT, 4 point average
703 MPa
102 ksi
Characteristic Strength
 @ RT, 4 point
744 MPa
108 ksi
Weibull Modulus (m) 14
Characteristic Strength
 @ RT, 4 point
641 MPa
93 ksi
Elastic Modulus (E) 317 GPa
46 Mpsi
Poisson's Ratio (v) 0.24
Hardness (Knoop 1 kg) 1480 kg/mm
Fracture Toughness (Vickers) 6.0 MPa*m
Thermal Expansion (RT-1000°C) 3.4 10
Thermal Conductivity (RT) 30.0 W/m*k
Thermal Shock Resistance (T) 700°C

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